Jootemetall 0.75Cu 99.25 Sn 33%

• 0.8 mm lead-free solder ideal for use on micro-electronics, fine wires and most of other electrical and electronic soldering applications
• Tin – lead has a melting point of 217 °C
• The tin – silver – copper solder provides a lower melting point of 207 °C and a low-resistance solder joint
• Designed for the most demanding jobs where precision is of the utmost importance